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BG25XF120K - IGBT

Features

  • • Low VCE (on) Non Punch Through IGBT Technology • Low Diode VF • 10µs Short Circuit Capability • Square RBSOA •.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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IGBT SIXPACK MODULE Features • Low VCE (on) Non Punch Through IGBT Technology • Low Diode VF • 10µs Short Circuit Capability • Square RBSOA • HEXFRED Antiparallel Diode with Ultrasoft Reverse Recovery Characteristics • Positive VCE (on) Temperature Coefficient • Ceramic DBC Substrate • Low Stray Inductance Design Benefits • Benchmark Efficiency for Motor Control • Rugged Transient Performance • Low EMI, Requires Less Snubbing • Direct Mounting to Heatsink • PCB Solderable Terminals • Low Junction to Case Thermal Resistance • UL Approved E78996 ECONO2 6PACK Absolute Maximum Ratings Parameter VCES IC @ Tc=25°C IC @ Tc=80°C ICM ILM IF @ Tc=25°C IF @ Tc=80°C IFM VGE PD @ Tc=25°C PD @ Tc=80°C TJ TSTG VISOL Collector-to-Emitter Voltage Continuous Collector Current Continuous Collector Curr
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