Description
of Intel’s thermal impedance test methodology.
Do not connect
PI.’ P1.1 P1.2 P1.3 P1.4 P1.5 P1,6 P1.7 RST RU2 P3.O TXD P3.1 INTO P3.2 INT1 P3,3 TOP3 4 11 P3.5 ~ P3.6 t% P3.7 XTAL2 XTAL1
I’__”ll
1
DataSheet4U.com Vcc
2 3 4 5 6 7 6 9 10 11 12 13 14 15 16 17 16 19
P’,’ ADO PO.1 AD1 PO.2 A02 PO.3 A03 PO.4 AD4 PO.5 AD5 P06 AD’ 3 PO.7A07 3 EIJvpp” Z ALEIPROG” 3%FFI 3 P2.7 A15 2 P2.6A14 3
Features
- of the MCS 51 Family, as listed below: written to them are pulled high by the internal pullDataSheet4U. com UPS,and in that state can be used as inputs. As inputs, Port 1 pins that are externally pulled low will Port Alternative Function source current (IIL on the data sheet) because of the Pin internal pullups. RXD (serial input port) P3,0 Port 1 also receives the low-order address bytes P3.1 TXD (serial output port) during programming of the EPROM parts and during INTO(external interrupt O) P3.