* 1700V Trench & Field Stop technology
* low turn-off losses
* short tail current
* positive temperature coefficient
* easy paralleling This chip is.

* drives Chip Type VCE IC Die Size SIGC101T170R3E 1700V 75A 10.03 x 10.03 mm2 C G E Package sawn on foil Mec.

AQL 0,65 for visual inspection according to failure catalogue Electrostatic Discharge Sensitive Device according to MIL-STD 883 Revision History Version Subjects (major changes since last revision) 2.1 Change wafer size to 200 mm 2.2 Additional ba.

SIGC101T170R3

SIGC100T60R3E

SIGC100T65R3E

SIGC104T170R2C

SIGC109T120R3

SIGC109T120R3E

SIGC109T120R3L

SIGC109T120R3LE

SIGC10T60

SIGC10T60E

SIGC10T60SE

SIGC10T65E

SIGC11T60NC

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