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HYE18L256160BF-75 Datasheet, Infineon

HYE18L256160BF-75 applications equivalent, drams for mobile applications.

HYE18L256160BF-75 Avg. rating / M : 1.0 rating-11

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HYE18L256160BF-75 Datasheet

Features and benefits

M O B I L E - R A M D E V I C E S come in a Fine-pitch Ball Grid Array (FBGA) package. These packages leverage Infineon’s proprietary wire bonding Board-On-Chip (BOC) te.

Application

I N F I N E O N ’ S M O B I L E - R A M cuts power consumption by up to 80 % (depending on operating conditions and syst.

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TAGS
HYE18L256160BF-75
DRAMs
for
Mobile
Applications
HYE18L256160BC-75
HYE18L128160BC-75
HYE18L128160BF-75
Infineon
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