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Infineon Technologies Electronic Components Datasheet

BSB017N03LX3G Datasheet

Power MOSFET

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BSB017N03LX3 G
OptiMOSTM3 Power-MOSFET
Features
• Optimized for high switching frequency DC/DC converter
• Very low on-resistance R DS(on)
• Excellent gate charge x R DS(on) product (FOM)
Product Summary
V DS
R DS(on),max
ID
30 V
1.7 m
147 A
• Low parasitic inductance
• Low profile (<0.7 mm)
• 100% avalanche tested
CanPAKTM M
MG-WDSON-2
• 100% Rg Tested
• Double-sided cooling
• Pb-free plating; RoHS compliant
• Compatible with DirectFET® package MX footprint and outline 1)
• Qualified according to JEDEC2) for target applications
Type
BSB017N03LX3 G
Package
MG-WDSON-2
Outline
MX
Marking
1103
Maximum ratings, at T j=25 °C, unless otherwise specified
Parameter
Symbol Conditions
Value
Unit
Continuous drain current
Pulsed drain current3)
Avalanche current, single pulse4)
Avalanche energy, single pulse
Gate source voltage
ID
I D,pulse
I AS
E AS
V GS
V GS=10 V, T C=25 °C
V GS=10 V, T C=100 °C
V GS=10 V, T A=25 °C,
R thJA=45 K/W2)
T C=25 °C
T C=25 °C
I D=40 A, R GS=25
147 A
93
32
400
40
225 mJ
±20 V
1) CanPAKTM uses DirectFET ® technology licensed from International Rectifier Corporation. DirectFET® is a registered
trademark of International Rectifier Corporation.
2) J-STD20 and JESD22
3) See figure 3 for more detailed information
4) See figure 13 for more detailed information
Rev. 2.0
page 1
2009-05-11
Free Datasheet http://www.datasheet4u.com/


Infineon Technologies Electronic Components Datasheet

BSB017N03LX3G Datasheet

Power MOSFET

No Preview Available !

Maximum ratings, at T j=25 °C, unless otherwise specified
Parameter
Symbol Conditions
Power dissipation
P tot T C=25 °C
T A=25 °C,
R thJA=45 K/W
Operating and storage temperature T j, T stg
IEC climatic category; DIN IEC 68-1
BSB017N03LX3 G
Value
57
2.8
-40 ... 150
55/150/56
Unit
W
°C
Parameter
Symbol Conditions
min.
Values
typ.
Unit
max.
Thermal characteristics
Thermal resistance, junction - case R thJC
- 1.0 - K/W
top - - 2.2
Device on PCB
R thJA 6 cm2 cooling area5)
-
- 45
Electrical characteristics, at T j=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V (BR)DSS V GS=0 V, I D=1 mA
30
-
-V
Gate threshold voltage
V GS(th) V DS=V GS, I D=250 µA
1
- 2.2
Zero gate voltage drain current
I DSS
V DS=30 V, V GS=0 V,
T j=25 °C
-
0.1 10 µA
V DS=30 V, V GS=0 V,
T j=125 °C
-
10 100
Gate-source leakage current
I GSS
V GS=20 V, V DS=0 V
-
10 100 nA
Drain-source on-state resistance
R DS(on) V GS=4.5 V, I D=25 A
-
2.0 2.5 m
V GS=10 V, I D=30 A
- 1.4 1.7
Gate resistance
RG
0.2 0.5 0.8
Transconductance
g fs
|V DS|>2|I D|R DS(on)max,
I D=30 A
65
130
-S
5) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
Rev. 2.0
page 2
2009-05-11
Free Datasheet http://www.datasheet4u.com/


Part Number BSB017N03LX3G
Description Power MOSFET
Maker Infineon
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BSB017N03LX3G Datasheet PDF






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