AUIRF7738L2TR
Description
The AUIRF7738L2 bines the latest Automotive HEXFET® Power MOSFET Silicon technology with the advanced DirectFET® packaging technology to achieve exceptional performance in a package that has the footprint of a DPak (TO-252AA) and only 0.7 mm profile.The DirectFET® package is patible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes.The DirectFET® package allows dual sided cooling to maximize thermal transfer in automotive power systems.
Key Features
- of this MOSFET are 175°C operating junction temperature and high repetitive peak current capability
- These features bine to make this MOSFET a highly efficient, robust and reliable device for high current automotive applications
