Maximum lead temperature for soldering Ÿ International standard packages Ÿ Low RDS (on) HDMOSTM process Ÿ Rugged polysilicon gate cell structure Ÿ Low package inductanc.

VDSS VGS(th) IGSS IDSS RDS(on) VGS = 0 V, ID = 250 µA VDS = VGS, ID = 250 µA VGS = ±20 VDC, VDS = 0 VDS = VDSS VGS = 0.

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