UL recognized package Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation Avanlache rated Fast .

Symbol Test Conditions (TJ = 25°C, unless otherwise specified) BVDSS VGS(th) IGSS IDSS RDS(on) VGS = 0V, ID = 250μA VDS.

IXFC14N80P

IXFC110N10P

IXFC12N80P

IXFC13N50

IXFC15N80Q

IXFC16N50P

IXFC16N80P

IXFC20N80P

IXFC24N50

IXFC26N50

IXFC26N50P

IXFC30N60P

IXFC36N50P

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