Silicon Chip on Direct-Copper Bond (DCB) Substrate Isolated Mounting Surface 4000V Electrical Isolation High Peak Current Capability Low Saturation Voltage Molding Epoxie.

( Electrically Isolated Tab) IXGF30N400 VCES = 4000V = 30A IC25 VCE(sat) ≤ 3.1V ISOPLUS i4-PakTM Symbol VCES VGES VGE.

IXGF32N170

IXGF36N300

IXGF25N250

IXGF25N300

IXGA10N60

IXGA10N60A

IXGA12N100

IXGA12N100A

IXGA12N100AU1

IXGA12N100U1

IXGA12N120A2

IXGA12N120A3

IXGA12N60B

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