z z International standard isolated package UL recognized package Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 25.

IXFR64N50Q3

IXFR64N60P

IXFR66N50Q2

IXFR100N25

IXFR102N30P

IXFR10N100F

IXFR10N100Q

IXFR120N20

IXFR120N25P

IXFR12N100F

IXFR12N100Q

IXFR140N20P

IXFR14N100Q2

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