IS66WVQ4M4DBLL
Description
The IS66/67WVQ4M4DALL/BLL are integrated memory device containing 16Mb Pseudo Static Random Access Memory, using a self-refresh DRAM array organized as 4M words by 4 bits. The device supports Quad DDR interface, which is compatible with JEDEC standard x4 xSPI Flash.
Key Features
- Industry Standard Serial Interface - Quad DDR (x4 xSPI) Interface: Command (1 byte) =SDR Address (2-byte) & Data = DDR - Low Signal Counts :7 Signal pins (CS#, SCLK, DQSM, SIO0~SIO3)
- High Performance - Double Data Rate (DDR) Operation: 200MHz (200MB/s) at 1.8V VCC 166MHz (166MB/s) at 3.0V VCC - Source Synchronous Output signal during Read Operation (DQSM) - Data Mask during Write Operation (DQSM) - Configurable Latency for Read/Write Operation - Supports Variable Latency mode and Fixed Latency mode - Configurable Drive Strength - Supports Wrapped Burst mode and Continuous mode - Supports Deep Power Down mode - Hidden Refresh
- Burst Operation - Configurable Wrapped Burst Length : 16, 32, 64, and 128 - Continuous Operation: - Continues Read operation until the end of array address (No Wrapped) - Continues Write operation even after the end of array address (Wrapped to first address)
- Low Power Consumption - Single 1.7V to 1.95V Voltage Supply - Single 2.7V to 3.6V Voltage Supply - 20 mA Operating at 200MHz (1.8V, max.)
- Hardware Features - SCLK Input: Serial clock input - SIO0 - SIO3: Serial Data Input or Serial Data Output - DQSM: - Output during command, address transactions as Refresh Collision Indicator - Output during read data transactions as Read Data Strobe - Input during write data transactions as Write Data Mask - RESET#: Hardware Reset pin
- Temperature Grades - Industrial: -40°C to +85°C - Auto (A2) Grade: -40°C to +105°C - Auto (A3) Grade: -40°C to +125°C
- Industry Standard PACKAGE - B = 24-ball TFBGA 6x8mm 5x5 Array - KGD (Call Factory) Integrated Silicon Solution, Inc.- 2 Rev. A4
