INPAQ TECHNOLOGY CO., LTD.
High Frequency Chip Ceramic Inductor for Automotive Engineering
Qualified based on AEC-Q200
Particular ceramic material and coil structure provide high frequency application range up to
Small size and low profile.
Available in various sizes.
Excellent solderability and heat resistance.
RF and wireless communication, information technology equipment which includes computer,
telecommunications, radar detectors, automotive electronics, cellular phones, pagers, audio
equipment, PDAs, keyless remote system and low-voltage power supply modules.
SHAPES AND DIMENSIONS
TITLE : MCI-HW Series Engineering
SPEC REV.: P0
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