.........................................................................................................................................................2 Package and Pin.

Can be parallel connected to increase the current drive capability. Chip-on-board process available. Applications AC LE.

.................................................................................................................................................2 Features ...............................................................................................

iML8683

IML10

IMLT65R015M2H

IMLT65R020M2H

IMLT65R040M2H

IMLT65R050M2H

IMLT65R060M2H

IM00GR

IM00JR

IM00NS

IM00TS

IM01CGR

IM01CTS

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