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Technical Overview
CD4000B Series
This section is intended as a guide for circuit and equipment designers in the operation and application of MOS integrated circuits. It covers general operating and handling considerations with respect to the following critical factors: • • • • • • • • • Operating Supply Voltage Range Power Dissipation and Derating System Noise Considerations Power Source Rules Gate-oxide Protection Networks Input Signals and Ratings Chip Assembly and Storage Device Mounting Testing Dynamic power dissipation has three components: 1. The dissipation that results from current that charges and discharges the external load capacitance of the output buffers.