SMF SERIES
SURFACE MOUNT
UNIDIRECTIONAL AND BIDIRECTIONAL
TRANSIENT VOLTAGE SUPPRESSORS
.
REVERSE VOLTAGE - 5.0 to 170 Volts
POWER DISSIPATION - 200 Watts
FEATURES
● For surface mounted applications in order to
optimize board space
● Low profile space
SOD-123FL
.114(2.9)
.098(2.5)
● Glass passivated chip
● Low inductance
● Excellent clamping capability
● Very fast response time
.039(1.0)
.024(0.6)
● Typical ID less than 1µA at VWM
● 200 W peak pulse power capability
with a 10/1000 µs waveform
● Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
MECHANICAL DATA
● Case: JEDEC SOD-123FL molded plastic
over passivated chip
● Terminals: Solder plated, solderable per
MIL-STD-750 Method 2026
● Polarity: For uni-directional types the band
by laser denotes the cathode, which is
.010(0.25)
.002(0.05)
.043(1.1)
.020(0.5)
.154(3.9)
.138(3.5)
.047(1.2)
.031(0.8)
.004(0.1)max
positive with respect to the anode under
normal TVS operation
Dimensions in inches and(millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25℃ ambient temperature unless otherwise specified.
Single phase, half wave ,60Hz, resistive or inductive load.
For capacitive load, derate current by 20%
CHARACTERISTICS
Peak pulse power dissipation
with a 10/1000µs waveform (see fig. 1)
Peak forward surge current 8.3ms single half sine-wave
Peak pulse current
with a waveform (see fig. 3 , single pulse)
Typical thermal resistance, junction to ambient(1)
Typical thermal resistance, junction to lead(1)
Operating Temperature Range
Storage Temperature Range
SYMBOL
PPPM
IFSM
IPPM
RθJA
RθJL
TJ
TSTG
Notes: 1.Mounted on P.C.B. with 0.036 x 0.06” (0.9 x 1.5mm) copper pad areas.
VALUE
200
20
See Next Table
120.0
30.0
-55 to + 150
-55 to + 150
UNIT
W
A
A
℃/W
℃/W
℃
℃
Rev. 8, 16-Mar-2017
