*Compatible with automatic placement equipment
*Compatible with reflow solder process █Applications：
*Automotive_Telecommunication
*Indicators
*LCD .

*Automotive_Telecommunication
*Indicators
*LCD Back-lights
*Illuminations Dice Material GaN Light Col.

： The Chip-LED Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. Besides, lightweight makes them ideal for miniature app.

LS-0730

LS-0810

LS-0880

LS-0905

LS-0940

LS-1050

LS-1300

LS-1550

LS-3101S

LS-3229

LS-377

LS-4101

LS-4111

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