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HSME-T700 - Surface Mount LED Indicator

Download the HSME-T700 datasheet PDF. This datasheet also covers the HSMD-T400 variant, as both devices belong to the same surface mount led indicator family and are provided as variant models within a single manufacturer datasheet.

General Description

These solid state surface mount indicators are designed with a flat top and sides to be easily handled by automatic placement equipment.

A glue pad is provided for adhesive mounting processes.

Key Features

  • Compatible with Automatic Placement Equipment.
  • Compatible with Infrared and Vapor Phase Reflow Solder Processes.
  • Packaged in 12 mm or 8 mm tape on 7" or 13" Diameter Reels.
  • EIA Standard Package.
  • Low Package Profile.
  • Nondiffused Package Excellent for Backlighting and Coupling to Light Pipes.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (HSMD-T400-HP.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number HSME-T700
Manufacturer HP
File Size 195.18 KB
Description Surface Mount LED Indicator
Datasheet download datasheet HSME-T700 Datasheet

Full PDF Text Transcription for HSME-T700 (Reference)

Note: Below is a high-fidelity text extraction (approx. 800 characters) for HSME-T700. For precise diagrams, and layout, please refer to the original PDF.

H Surface Mount LED Indicator Technical Data HSMD-TX00 HSME-TX00 HSMG-TX00 HSMH-TX00 HSMS-TX00 HSMY-TX00 Features • Compatible with Automatic Placement Equipment • Compat...

View more extracted text
TX00 Features • Compatible with Automatic Placement Equipment • Compatible with Infrared and Vapor Phase Reflow Solder Processes • Packaged in 12 mm or 8 mm tape on 7" or 13" Diameter Reels • EIA Standard Package • Low Package Profile • Nondiffused Package Excellent for Backlighting and Coupling to Light Pipes Description These solid state surface mount indicators are designed with a flat top and sides to be easily handled by automatic placement equipment. A glue pad is provided for adhesive mounting processes. They are compatible with convective IR and vapor phase reflow soldering and conductive epoxy attachment processes