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FBM0402 - Multilayer Chip Bead

General Description

HITANO ENTERPRISE CORP.

7F-7, No.

New Taipei City, TAIWAN, R.O.C.

Key Features

  • Excellent solderability and high heat resistance for either flow or reflow soldering.
  • A closed circuit formed by internal silver printed layer, acting like a magn.

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Datasheet Details

Part number FBM0402
Manufacturer HITANO
File Size 219.74 KB
Description Multilayer Chip Bead
Datasheet download datasheet FBM0402 Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Data Sheet Customer: Product: Multilayer Chip Bead – FBM Series Size : 0402/0603/0805/1204/1206/1210/1808/1812 Issued Date: 30-September-2014 Edition: Ver. 1 Record of change Date Ver. 30-Sep.-2014 1 Description Page HITANO ENTERPRISE CORP. 7F-7, No. 3, Wu Chuan 1st Road, New Taipei Industrial Park, New Taipei City, TAIWAN, R.O.C. Tel: +886 2 2299 1331 (Rep.) Fax: +886 2 2298 2466, 2298 2969 Prepared by 30-Sep.-2014 Andy Hsu Checked by 30-Sep.-2014 Hwa Wu Approved by 30-Sep.-2014 Hwa Wu Accepted by (customer) MULTILAYER CHIP BEAD FBM SERIES n Introductions The FBM series chip ferrite devices are categorized as noise limiting for EMI/RFI issue and products.