RGP15M Datasheet | General Semiconductor

FEATURES - Plastic package has Underwriters Laboratory Flammability Classification 94V-0 - High temperature metallurgically bonded construction - Glass passivated cavity-free junction - Capable of meeting environmental standards of MIL-S-19500 - 1.5 Ampere operation at TA=55°C with no thermal runaway - Typical IR less than 0.1µA - High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension 0.300 (7.6) 0.230 (5.8) 0.140 (3.6) 0.104 (2.6) DIA. 1.0 (25.4) MIN. Dimensions in inches and (millimeters) MECHANICAL DATA Case: JEDEC DO-204AC molded plastic over glass body Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.015 ounce, 0.4 gram - Glass-plastic encapsulation technique is covered by Patent No. 3,996,602 and brazed-lead assembly by Patent No. 3,930, 306 ® MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS RGP 15A RGP 15B RGP 15D RGP 15G RGP 15J RGP 15K RGP 15M UNITS Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current 0.375" (9.5mm) lead length at TA=55°C Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage at 1.5A Maximum DC reverse current at rated DC blocking voltage TA=25°C TA=150°C VRRM VRMS VDC I(AV) 50 35 50 100 70 100 200 140 200 400 280 400 1.5 600 420 600 800 560 800 1000 700 1000 Volts Volts Volts Amps IFSM VF IR IR(AV) trr CJ RΘJA TJ, TSTG 150 50.0 1.3 5.0 200.0 100.0 250 25.0 45.0 -65 to +175...