RGF1J Datasheet | General Semiconductor

FEATURES - Plastic package has Underwriters Laboratory Flammability Classification 94V-0 - Ideal for surface mount automotive applications - High temperature metallurgically bonded construction - Glass passivated cavity-free junction - Capable of meeting environmental standards of MIL-S-19500 - Built-in strain relief - Easy pick and place - Fast switching for high efficiency - High temperature soldering guaranteed: 450°C/5 seconds at terminals - plete device submersible temperature of 265°C for 10 seconds in solder bath 0.060 (1.52) 0.040 (1.02) 0.187 (4.75) 0.167 (4.24) 0.0105 (0.27) 0.0065 (0.17) 0.118 (3.00) 0.106 (2.69) 0.108 (2.74) 0.098 (2.49) 0.060 (1.52) 0.030 (0.76) 0.152 TYP. 0.006 0.226 (5.74) 0.196 (4.98) 0.114 (2.90) 0.094 (2.39) Patent No. 3,996,602, brazed-lead assembly by Patent No. 3,930,306 and lead forming by Patent No. 5,151,846 ® - Glass-plastic encapsulation technique is covered by Dimensions in inches and (millimeters) MECHANICAL DATA Case: JEDEC DO-214BA molded plastic over glass body Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.0048 ounce, 0.120 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS RGF1A RGF1B RGF1D RGF1G RGF1K RGF1M UNITS Device Marking Code Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TL=120°C Peak forward surge current 8.3ms single half sinewave superimposed on rated load (JEDEC method) Maximum instantaneous forward voltage at 1.0A Maximum full load reverse current, full cycle average, TA=55°C Maximum DC reverse current at rated DC blocking voltage TA=25°C TA=125°C VRRM VRMS VDC I(AV) IFSM VF IR(AV) IR trr CJ RΘJA RΘJL TJ, TSTG RA 50 35...