General Semiconductor ·
File Size : 52.70KB · 1 hits
Features and Benefits
E D
DO-204AP
0.034 (0.86) 0.028 (0.71) DIA. 1.0 (25.4) MIN.
0.240 (6.1) MAX.
0.150 (3.8) 0.100 (2.5) DIA.
1.0 (25.4) MIN.
♦ High temperature metallurgically bonded construction ♦ Hermetically sea.
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File Size : 52.70KB ·
1 hits
