FEPB6 Datasheet | General Semiconductor

FEATURES - Plastic package has Underwriters Laboratory Flammability Classification 94V-0 - Dual rectifier construction, positive center-tap - Glass passivated chip junctions - Superfast recovery times for high efficiency - Low power loss - Low forward voltage, high current capability - For use in low voltage, high frequency inverters, free wheeling and polarity protection applications - High temperature soldering in accordance with CECC 802 / Reflow guaranteed 0.320 (8.13) 0.360 (9.14) 1 K 2 0.575 (14.60) 0.625 (15.88) SEATING PLATE -T- 0.090 (2.29) 0.110 (2.79) 0.018 (0.46) 0.025 (0.64) 0.027 (0.686) 0.037 (0.940) 0.080 (2.03) 0.110 (2.79) 0.095 (2.41) 0.100 (2.54) MECHANICAL DATA PIN 1 K - HEATSINK PIN 2 Dimensions are in inches and (millimeters) Case: JEDEC TO-263AB molded plastic body Terminals: Plated lead solderable per MIL-STD-750, Method 2026 Polarity: As marked Mounting Position: Any Weight: 0.08 ounce, 2.24 grams MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS FEPB6AT FEPB6BT FEPB6CT FEPB6DT UNITS Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current TC=100°C Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage per leg at 3.0A Maximum DC reverse current at rated DC blocking voltage Typical thermal resistance (NOTE 2) Typical junction capacitance per leg (NOTE 3) Operating junction and storage temperature range NOTES: (1) Reverse recovery test conditions: IF=0.5A, Ir=1.0A, Irr=0.25A (2) Thermal resistance from junction to case per leg mounted on heatsink (3) Measured at 1.0 MHZ and applied reverse voltage of 4.0 Volts VRRM VRMS VDC I(AV) 50 35 50 100 70 100 6.0 150 105 150 200 140 200 Volts Volts Volts Amps IFSM Amps VF IR trr RΘJC CJ TJ, TSTG 0.975 5.0 50.0 35.0 3.6 28.0 -55 to...