z Planar die construction. z 500mW power dissipation on ceramic PCB. z General purpose, medium current. Pb Lead-free z Ideally suited for automated assembly processes. .

z Zener diode. z Ultra-small surface mount package. SOD-123 ORDERING INFORMATION Type No. BZT52C2V4-BZT52C51 Marking .

BZT52C3V0

BZT52C3V0-F

BZT52C3V0-G

BZT52C3V0-V

BZT52C3V0CR-C

BZT52C3V0K

BZT52C3V0LP

BZT52C3V0S

BZT52C3V0S-FL

BZT52C3V3-F

BZT52C3V3-G

BZT52C3V3-V

BZT52C3V3CR-C

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