Datasheet Summary
Preliminary GS8342T08/09/18/36E-333/300/267- /250/200/167
165-Bump BGA mercial Temp Industrial Temp Features
- Simultaneous Read and Write SigmaCIO™ Interface
- mon I/O bus
- JEDEC-standard pinout and package
- Double Data Rate interface
- Byte Write (x36 and x18) and Nybble Write (x8) function
- Burst of 2 Read and Write
- 1.8 V +100/- 100 mV core power supply
- 1.5 V or 1.8 V HSTL Interface
- Pipelined read operation with self-timed Late Write
- Fully coherent read and write pipelines
- ZQ pin for programmable output drive strength
- IEEE 1149.1 JTAG-pliant Boundary Scan
- 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package
- RoHS-pliant 165-bump BGA package available
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