MMSZ5262AS Key Features
- Planar Die construction
- 200mW Power Dissipation
- Ideally Suited for Automated Assembly Processes
- Pb free product: 99% Sn above can meet RoHS environment Substance request
- Case: SOD-323, Molded plastic
- Terminals: Solderable per MIL-STD-750, Method 2026
- Polarity: See diagram below
- Approx. Weight: 0.0041 gram
- Mounting position: Any
