MMSZ5252AS
Key Features
- Planar Die construction SOD-323
- 200mW Power Dissipation
- Ideally Suited for Automated Assembly Processes
- Pb free product: 99% Sn above can meet RoHS environment Substance request Mechanical Data
- Case: SOD-323, Molded plastic
- Terminals: Solderable per MIL-STD-750, Method 2026
- Polarity: See diagram below
- Approx. Weight: 0.0041 gram
- Mounting position: Any Unit: inch(mm) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Power Dissipation at 25 OC Parameter Operating Junction and Storage Temperature Range Notes: A. Mounted on 5.0mm2(.013mm thick)land areas Symbol PD TJ Value 200 -55 to +150
