DGS60 chips equivalent, general purpose rectifier gpp chips.
˙ Fully glass passivated -needs no encapsulation ˙ Peak reverse voltage to 1800 volts ˙ Low forward voltage drop(VF) ˙ Metallized surface
Glass
AT w
Description
The G.
The GPP chips series are diffused silicon, glass passivated rectifier die.
These devices can be supplied to meet customer’s requirements.
The prime application for unencapsulated die is in hybrid circuits. For
this reason, a variety of metallized.
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