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TDF30J - Silicon Bridge Rectifiers

Features

  • Planar passivated chips.
  • Ultra low leakage reverse current.
  • High temperature performance.
  • High surge current capability.
  • RoHS Compliant Mechanical Data.
  • Low profile saves space on printed circuit boards.
  • Molding compound, UL flammability classification rating 94V-0.
  • Terminals: Matte tin plated leads, solderable perJ-STD-002 and JESD22-B102.
  • Polarity: As marked on body Maximum Ratings (@TA = 25°C unless otherwise specified) Characteristic Symbol T.

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Other Datasheets by Galaxy Microelectronics

Part Number Description
TDF30K Silicon Bridge Rectifiers
TDF30M Silicon Bridge Rectifiers
TDF10M Silicon Bridge Rectifiers
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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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SuperPlanarTM Bridge Rectifiers Production specification TDF30J--TDF30K Features  Planar passivated chips  Ultra low leakage reverse current  High temperature performance  High surge current capability  RoHS Compliant Mechanical Data  Low profile saves space on printed circuit boards  Molding compound, UL flammability classification rating 94V-0  Terminals: Matte tin plated leads, solderable perJ-STD-002 and JESD22-B102  Polarity: As marked on body Maximum Ratings (@TA = 25°C unless otherwise specified) Characteristic Symbol TDF30J Peak repetitive reverse voltage V RRM 600 RMS reverse voltage V RMS 420 DC blocking voltage VDC 600 Maximum average forward output current I F(AV) 3.0 Peak forward surge current, 8.
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