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SPC5606S Datasheet

Microcontroller

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Freescale Semiconductor
Data Sheet: Advance Information
Document Number: MPC5606S
Rev. 1, 10/2008
MPC560xS Microcontroller
Data Sheet
MPC5606S
MAPBGA–225LQFP–144
QFN12
15 mm x 15 m2m0 mm x 20 mm ##_mm_x_##mm
LQFP–176
SOT-343R 24 mm x 24 mm
TBD##_mm_x_##mm
PKG-TBD
## mm x ## mm
32-bit MCU for cluster applications with stepper motor, TFT
graphic controller and LCD driver
The MPC5606S family of devices is designed to enable the development of automotive instrument cluster applications by
providing a single-chip solution capable of hosting real-time applications and driving a TFT display directly using an on-chip
color TFT display controller.
MPC5606S devices incorporate a cost-efficient host processor core compliant with the Power Architecture™ embedded
category. The processor is 100% user-mode compatible with the original PowerPC user instruction set architecture (UISA) and
capitalizes on the available development infrastructure of current Power ArchitectureTM devices with full support from
available software drivers, operating systems and configuration code to assist with users' implementations.
Offering high performance processing at speeds up to 64 MHz, the MPC5606S family is optimized for low power consumption
and supports a range of on-chip SRAM and internal flash memories. The 1 MB flash version (MPC5606S) features 160 KB of
on-chip graphics SRAM.
Refer to Table 1 for specific memory and feature sets of the product family members.
This document describes the features of the MPC5606S family of microcontrollers and highlights important electrical and
physical characteristics of the devices. For functional characteristics, refer to the MPC5606S Microcontroller Reference
Manual.
www.DataSheet4U.com
This document contains information on a product under development. Freescale reserves the
right to change or discontinue this product without notice.
© Freescale Semiconductor, Inc., 2008. All rights reserved.
Preliminary—Subject to Change Without Notice

Freescale Semiconductor Electronic Components Datasheet

SPC5606S Datasheet

Microcontroller

No Preview Available !

Table of Contents
1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.1 Device Comparison. . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.2 MPC5606S Features. . . . . . . . . . . . . . . . . . . . . . . . . . . .5
1.3 MPC5606S Series Blocks . . . . . . . . . . . . . . . . . . . . . . . .6
1.3.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . .6
1.3.2 Block Summary . . . . . . . . . . . . . . . . . . . . . . . . . .7
2 Pinout and Signal Descriptions. . . . . . . . . . . . . . . . . . . . . . . . .9
2.1 144 LQFP Package Pinout . . . . . . . . . . . . . . . . . . . . . .10
2.2 176 LQFP Package Pinout . . . . . . . . . . . . . . . . . . . . . .11
2.3 208 MAPBGA Package Pinout . . . . . . . . . . . . . . . . . . .11
2.4 Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
2.4.1 Pad Configuration during Reset Phases . . . . . .13
2.4.2 Voltage Supply Pins. . . . . . . . . . . . . . . . . . . . . .13
2.4.3 Pad Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
2.4.4 System Pins. . . . . . . . . . . . . . . . . . . . . . . . . . . .15
2.4.5 Nexus Pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
2.4.6 Functional Ports A, B, C, D, E, F, G, H, I, J, K . .18
2.4.7 Signal Details. . . . . . . . . . . . . . . . . . . . . . . . . . .36
3 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
3.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . .39
3.1.1 Recommended Operating Conditions . . . . . . . .41
3.2 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .44
3.2.1 General Notes for Specifications at Maximum
Junction Temperature . . . . . . . . . . . . . . . . . . . .45
3.3 EMI (Electromagnetic Interference) Characteristics . . .47
3.4 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . .47
3.4.1 Voltage Regulator Electrical Characteristics . . .47
3.4.2 Voltage monitor electrical characteristics. . . . . .48
3.4.3 Low voltage domain power consumption. . . . . .49
3.5 DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . .50
3.6 I/O Pad Electrical Characteristics . . . . . . . . . . . . . . . . .50
3.6.1 I/O Pad Types . . . . . . . . . . . . . . . . . . . . . . . . . .50
3.6.2 I/O Input DC Characteristics . . . . . . . . . . . . . . 50
3.6.3 I/O Output DC Characteristics . . . . . . . . . . . . . 51
3.6.4 I/O Pad Current Specification. . . . . . . . . . . . . . 55
3.7 RESET electrical characteristics . . . . . . . . . . . . . . . . . 57
3.8 Main Oscillator Electrical Characteristics . . . . . . . . . . 59
3.9 Low Power Oscillator Electrical Characteristics. . . . . . 61
3.10 FMPLL Electrical Characteristics. . . . . . . . . . . . . . . . . 62
3.11 Main RC Oscillator Electrical Characteristics . . . . . . . 63
3.12 Low Power RC Oscillator Electrical Characteristics . . 64
3.13 Flash Memory Electrical Characteristics . . . . . . . . . . . 64
3.14 Analog to Digital Converter (ADC) Electrical Characteristics
65
3.14.1 Input Impedance and ADC Accuracy . . . . . . . . 66
3.14.2 ADC Electrical Characteristics . . . . . . . . . . . . . 70
3.15 AC Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
3.15.1 Pad AC Specifications . . . . . . . . . . . . . . . . . . . 72
3.16 AC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
3.16.1 IEEE 1149.1 Interface Timing . . . . . . . . . . . . . 74
3.16.2 Nexus Debug Interface. . . . . . . . . . . . . . . . . . . 77
3.16.3 Interface to TFT LCD Panels . . . . . . . . . . . . . . 78
3.16.4 External Interrupt (IRQ) and Non-Maskable
Interrupt (NMI) Timing . . . . . . . . . . . . . . . . . . . 81
3.16.5 Enhanced Modular I/O Subsystem (eMIOS) Timing
82
3.16.6 FlexCAN Timing . . . . . . . . . . . . . . . . . . . . . . . . 82
3.16.7 Deserial Serial Peripheral Interface (DSPI) . . . 83
3.16.8 I2C Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
3.16.9 Mechanical Outline Drawings. . . . . . . . . . . . . . 89
3.17 144 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
3.18 176 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
4 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
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MPC560xS Microcontroller Data Sheet Data Sheet, Rev. 1
2
Preliminary—Subject to Change Without Notice
Freescale Semiconductor


Part Number SPC5606S
Description Microcontroller
Maker Freescale Semiconductor
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