MC33662 - LIN Physical Layer

Freescale Semiconductor (now NXP Semiconductors)

Datasheet Details

Part number	MC33662
Manufacturer	Freescale Semiconductor (now NXP Semiconductors)
File Size	507.88 KB
Description	LIN Physical Layer
Datasheet	MC33662 Datasheet

Overview

Freescale Semiconductor Advance Information Document Number: MC33662 Rev.

7.0, 1/2014 LIN 2.1 / SAEJ2602-2, LIN Physical Layer 33662 The Local Interconnect Network (LIN) is a serial communication protocol, designed to support automotive networks in conjunction with a Controller Area Network (CAN).

Key Features

of CAN are not required. The three 33662 versions are designed to operate at different maximum baud rates. The 33662LEF and 33662BLEF, and the 33662SEF and 33662BSEF, offer a normal baud rate (20 kbps), and the 33662JEF and 33662BJEF, a slow baud rate (10 kbps). They integrate a fast baud rate (above 100 kbps), as reported by the RXD pin for test and programming modes. They provide excellent EMC (Electromagnetic Compatibility) and Radiated Emission performance, ESD (Electrostatic Discharge) robu.

More Datasheets from Freescale Semiconductor (now NXP Semiconductors)

Part Number	Description
MC33660	ISO K Line Serial Link Interface
MC33661	Local Area Network (LIN) Enhanced Physical Interface
MC33663	DUAL LIN TRANSCEIVER
MC33689D	SPI Controller
MC33696	PLL Tuned UHF Transceiver
MC33186	H-Bridge Driver
MC33285	Dual High-Side TMOS Driver
MC33397	Dual/Hex Low-Side Switch
MC33399	Local Interconnect Network (LIN) Physical Interface
MC33399PEF	Local Interconnect Network (LIN) Physical Interface