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Chip Silicon Rectifier
HFM301 THRU HFM307
Ultra fast recovery type
Formosa MS
SMC
0.276(7.0) 0.260(6.6) 0.012(0.3) Typ.
Features
Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. For surface mounted applications. Exceeds environmental standards of MIL-S-19500 / 228 Low leakage current.
0.032(0.8) Typ. 0.040(1.0) Typ. 0.152(3.8) 0.144(3.6)
0.189(4.8) 0.173(4.4)
0.244(6.2) 0.228(5.8)
0.087(2.2) 0.071(1.8)
Mechanical data
Case : Molded plastic, JEDEC DO-214AB Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 Polarity : Indicated by c athode band Mounting P osition : Any Weight : 0.00585 ounce, 0.195 gram
0.040 (1.0) Typ.