Chip Schottky Barrier Diodes
FM150L THRU FM160L
Formosa MS
Silicon epitaxial planer type
Features
Plastic package has Underwriters Laboratory
Flammability Classification 94V-O Utilizing Flame
Retardant Epoxy Molding Compound.
For surface mounted applications.
Exceeds environmental standards of MIL-S-19500 /
228
Low leakage current.
Mechanical data
Case : Molded plastic, JEDECDO-214AC
Terminals : Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity : Indicated by c athode band
Mounting Position : Any
Weight : 0.0015 ounce, 0.05 gram
SMA
0.185(4.8)
0.173(4.4)
0.012(0.3) Typ.
0.110(2.8)
0.094(2.4)
0.165(4.2)
0.150(3.8)
0.040(1.0) Typ.
0.067(1.7)
0.060(1.5)
0.040 (1.0) Typ.
Dimensions in inches and (millimeters)
MAXIMUM RATINGS (AT TA=25oC unless otherwise noted)
PARAMETER
CONDITIONS
www.DatFaoSrwhaeredt4rUec.ctoimfied current
Forward surge current
See Fig.1
8.3ms single half sine-wave superimposed on
rate load (JEDEC methode)
Reverse current
Thermal resistance
VR = VRRM TA = 25oC
VR = VRRM TA = 125oC
Junction to ambient
Diode junction capacitance
f=1MHz and applied 4vDC reverse voltage
Storage temperature
Symbol
IO
IFSM
IR
RqJA
CJ
TSTG
MIN.
-55
TYP.
88
120
MAX.
1.0
UNIT
A
30 A
0.5
10
+150
mA
mA
oC / w
pF
oC
SYMBOLS
FM150L
FM160L
MARKING
CODE
SS15
SS16
VRRM *1
(V)
50
60
VRMS *2
(V)
35
42
VR *3
(V)
50
60
VF *4
(V)
0.60
Operating
temperature
(oC)
-55 to +150
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
*4 Maximum forward voltage
