November 2015
BZX84C3V3 - BZX84C33
Zeners
Tolerance: C = 5%
3
1
SOT-23
2
CONNECTION
DIAGRAM
3
1 2 NC
Absolute Maximum Ratings(1),(2)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.
Symbol
Parameter
Value
Unit
IFRM
IZRM
PD
RθJA
Repetitive Peak Forward Current
Repetitive Peak Working Current
Power Dissipation
Referencing RθJA, TA = 25°C
Referencing ψJL, TL = 25°C
Junction-to-Ambient Thermal Resistance(3)
250
250
250
550
465
mA
mA
mW
°C/W
ψJL
Junction-to-Lead Thermal Characteristics
(with reference to Cathode)
220 °C/W
TSTG
TJ
Storage Temperature Range
Operating Junction Temperature
-55 to +150
-55 to +150
°C
°C
Notes:
1. These ratings are based on a maximum junction temperature of 150°C.
2. These are steady-state limits. Fairchild Semiconductor should be consulted on applications involving pulsed or
low-duty-cycle operations.
3. Device mounted on FR-4 PCB, board size = 76.2 mm x 114.3 mm
© 2001 Fairchild Semiconductor Corporation
BZX84C3V3 - BZX84C33 Rev. 1.10
www.fairchildsemi.com
