Description
The solder pads provide an excellent heat sink..
Features
- Solid state ceramic chip Surface mounting device High thermal conductivity End - to - end and side - to - side stackable down to a pitch of 1.3 mm Solder pads conform with Mil-Std 883 B
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Maximum Ratings at 25° C
Storage temperature Operating temperature Soldering temperature
Tst Top Tsold (10 s)
-25° C to 120° C -25° C to 85° C 240° C
Optical and Electronic Characteristics at 25° C
Collector emitter breakdown voltage (VCE)
Dark current (ICEO) Saturation voltage (VCEsat) Wa.
