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EHP-B05 - CRI 75 White LED

General Description

2 2 chips 4 4 chips 6 6 chips 8 8 chips 3.

Key Features

  • Small package with high efficiency.
  • ESD protection up to 8KV.
  • Soldering method: SMT.
  • Binning Parameters: Brightness, Forward Voltage ,Wavelength and Chromaticity.
  • Moisture Sensitivity Level: 3.
  • RoHS compliant.
  • Matches ANSI binning.
  • Reliability testing conforms to IESNA LM80 Lumen maintenance test method 1 Revision.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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DATASHEET EHP- B05 Series EHP-B05 series Introduction B05 series to be a high power, multi-chip device with very low thermal resistance as a result of the PCB substrate. The series is a surface-mount high-power device featuring high brightness that is suitable for all kinds of lighting applications such as general illumination, spot, signal, industrial and commercial lighting. www.DataSheet.co.