‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and cli.

SMB2EZ51

SMB2EZ5.1D5

SMB2EZ5.6D5

SMB2EZ56

SMB2EZ56D5

SMB2EZ5V1

SMB2EZ5V6

SMB2EZ10

SMB2EZ100

SMB2EZ100D5

SMB2EZ10D5

SMB2EZ11

SMB2EZ110

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