‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and cli.

SMB2EZ30

SMB2EZ300D5

SMB2EZ3.0D5

SMB2EZ3.3D5

SMB2EZ3.6D5

SMB2EZ3.9D5

SMB2EZ33

SMB2EZ330D5

SMB2EZ33D5

SMB2EZ36

SMB2EZ36D5

SMB2EZ39

SMB2EZ39D5

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