‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and cli.

3EZ75D10

3EZ75D5L

3EZ75

3EZ7.5

3EZ7.5D10

3EZ7.5D5

3EZ7.5D5L

3EZ1

3EZ10

3EZ100

3EZ100D10

3EZ100D5

3EZ100D5L

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