‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and cli.

3EZ68D10

3EZ68D5L

3EZ68

3EZ6.2

3EZ6.2D10

3EZ6.2D5

3EZ6.2D5L

3EZ6.2D5RL

3EZ6.8

3EZ6.8D10

3EZ6.8D5

3EZ6.8D5L

3EZ62

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