‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and cli.

3EZ51D10

3EZ51D5L

3EZ51

3EZ5.1D10

3EZ5.1D5

3EZ5.1D5L

3EZ5.6D10

3EZ5.6D5

3EZ5.6D5L

3EZ56

3EZ56D10

3EZ56D5

3EZ56D5L

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