‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and cli.

3EZ43D10

3EZ43D5L

3EZ43

3EZ4.3D10

3EZ4.3D5

3EZ4.3D5L

3EZ4.7D10

3EZ4.7D5

3EZ4.7D5L

3EZ400D5

3EZ400D5L

3EZ47

3EZ47D10

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