‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and cli.

3EZ33D10

3EZ33D5L

3EZ33

3EZ330D5

3EZ330D5L

3EZ3.3D5

3EZ3.6D5

3EZ3.9D10

3EZ3.9D5

3EZ3.9D5L

3EZ30

3EZ300D5

3EZ300D5L

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