‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and cli.

3EZ100D10

3EZ100D5L

3EZ100

3EZ10

3EZ10D10

3EZ10D5

3EZ10D5L

3EZ1

3EZ11

3EZ110

3EZ110D10

3EZ110D5

3EZ110D5L

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