‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and cli.

2EZ62D10

2EZ62D5L

2EZ62

2EZ6.2

2EZ6.2D10

2EZ6.2D5

2EZ6.2D5L

2EZ6.5D10

2EZ6.5D5

2EZ6.8

2EZ6.8B

2EZ6.8D10

2EZ6.8D5

Since 2006. D4U Semicon.   |   Contact Us   |   Privacy Policy   |   Purchase of parts