‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and cli.

2EZ33D10

2EZ33D5L

2EZ33

2EZ330

2EZ330D5

2EZ33B

2EZ3.0D10

2EZ3.0D5

2EZ3.3D10

2EZ3.3D5

2EZ3.6D10

2EZ3.6D5

2EZ3.6D5L

Since 2006. D4U Semicon.   |   Contact Us   |   Privacy Policy   |   Purchase of parts