WEDPNF8M721V-1012BI Overview
White Electronic Designs WEDPNF8M721V-XBX 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package ADVANCED.
WEDPNF8M721V-1012BI Key Features
- 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm mercial, Industrial and Military Temperature Ranges Weight
- WEDPNF8M721V-XBX
- 2.5 grams typical n n n n Sector Architecture
- One 16KByte, two 8KBytes, one 32KByte, and fif teen 64KBytes in byte mode
- One 8K word, two 4K words, one 16K word, and fifteen 32K word sectors in word mode
- Any bination of sectors can be concurrently erased. Also supports full chip erase Boot Code Sector Architecture (Bottom)
- Supports reading data from or programing data to a sector not being erased
- 14% I/O Reduction Suitable for hi-reliability
WEDPNF8M721V-1012BI Applications
- This data sheet describes a product that may or may not be under development and is subject to change or cancellation without notice