*： Encapsulation: Epoxy Resin Green InGaN Blue InGaN
*： Soldering methods: Pb-Free reflow soldering
*，，， High Luminous Intensity ,Low Power Dissipati.

：
* ： Red Material: AlGaInP Features:
*： Encapsulation: Epoxy Resin Green InGaN Blue InGaN
*： S.

NH005

NH010

NH020

NH025

NH033x-L

NH050

NH050x-L

NH100

NH1302A

NH15002

NH2054

NH2054A24

NH2054HD24

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