DT3-2.5 Product details
Description
Base Model Lapped Model Sealed Model Lapped and Sealed Model
Features
Solid state reliability Built with high temperature solder with the ability to withstand higher assembly processing temperatures for short periods of time (
Features
- industries inc. ®
DT3-2.5
Thermoelectric Cooler
Performance Values
Hot Side Temperature (°C) ∆ Tmax (°C-dry N2): Qmax (watts): Imax (amps): Vmax (vdc): AC Resistance (ohms): 27°C 65 6 2.5 3.6 1.2 50°C 73 6 2.5 4.1.
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Mechanical Characteristics
TOP VIEW
.807 [20.5] .630 [16]
.630 [16] Col.
