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ES Components
MZCxxxAx and MZCxxxBx Family Bare Die
DATA SHEET
Small Signal Zener Diodes
Wire Bondable, Epoxy Attach Bare Die
Rev: B
FEATURES
• Wafer fab by Vishay Semiconductor • Silicon planar Zener diode
MECHANICAL DATA
Top Metal ( Anode )
Back Metal ( Cathode )
Passivation
AlSi AuSb Nitride
THERMAL CHARACTERISTICS
Parameter: Junction Temperature (max) Operating Temperature Range Storage Temperature Range
Symbol: TJ TOP TS
Value: +175 -55 to +175 -55 to +175
Unit °C °C °C
DEVICE CODE
MZC Prefix
MZC
6.8
Zener Voltage
2.4 to 75 (See Table)
A Series
A = High Level B = Low Level
5
Tolerance (%VZ)
2 5 10
E Bottom Side Attach Method
Epoxy Die Attach
B Top Side Connection Method
Wire Bondable
D Form
D = Die
108 Pratts Junction Road / Sterling, MA 01564 / P) 978.422.
MZC9.1B5 Datasheet
