EMTCG176-3G
EMTCG176-3G is 176KB Flash Smart Card IC manufactured by EM Microelectronic.
EM MICROELECTRONIC
- MARIN SA
Theseus
Cipher Gold 176-3G
176KB Flash Smart Card IC + Cryptography Engine
Environment Voltage Supply Class A, B: 3.0V to 5.0V ± 10% -25 to +85 °C Operating Temperature Max supply current 6m A @ 30MHz, Class B > 4 k V ESD Protection HBM CPU Software patible CMOS 80X51 industry standard Local RAM 256 B (data, idata memory spaces) “far” addressing support extending ‘xdata’ up to 8MB Accelerated architecture with 16 bit CPU performance level Up to 30 MHz internal CPU clock Idle Modes Idle and Stop mode selectable modes NVM operation possible with CPU in idle mode IO Transmission and Reception with CPU in idle mode Max Idle current 200 u A Cryptography Resources DES / TDES Hardware accelerator CBC mode Hardware acceleration Hardware Random Number Generator FIPS140-2 Security Unique chip identification number Notification of tampering Internal clock generation IC operates under regulated voltage DPA/SPA resistance mechanisms Under / Over voltage sensors (Vcc) CRC Hardware module featuring CRC16 and ISO3309 CRC Memory Control Memory Management Unit (MMU) Code / Data flexible memory partitioning thanks to GPNVM512 General Purpose NV Memory Application Secure OS partitioning (HW Firewall) Extended addressing capability with Java Mode for optimal memory mapping EEPROM and GPNVM512 Fast Byte program: 40 us / Byte EEPROM Erase write control EEPROM Write in FLASH Mode EEPROM Multiple Page Erase up to 128 Bytes I/O
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ISO 7816-3 pliant electrical interface ISO 7816-3 pliant reset and response T=0 T=1 protocols
Memories 3072 bytes RAM (xdata space) 128KB GPNVM512 (General Purpose Non Volatile Memory with 512B / Page) 48KB EEPROM 10 year data retention for EEPROM / GPNVM512 EEPROM, GPNVM512 Endurance > 100 K cycles Chip Forms 8” Wafer sawn or unsawn Back grinding and distressing options 180 microns max thickness Modules
EMTCG176-3G is...
